Through testing, teardown, chip level analysis and other technical methods, to help customers to understand the technical advantage of competitive products.
Package analysis: X-ray, thickness of substrate, bonding analysis, etc.
Die analysis: die size, feature size, M1/PL profile, floor plan analysis, etc.
Manufacturing process: gate oxygen thickness, polycide and silicide structure, side wall structure and dimensions, etc.
Key technology analysis: power and ground distribution, IP core analysis, ESD characteristics, low power analysis, memory type and capacity, etc.
Other customized requirements: MPW, full mask production cost, packaging and testing cost estimating, etc.
Process analysis includes surface analysis, cross section structure and material analysis.
On the one hand, process analysis can be used as a method of obtaining evidence of process infringement in patent litigation.
On the other hand, it can also be used as an important detection method for product failure analysis.
Cellix's chip process analysis service supports 7nm FinFET chip analysis, covers CPU, FPGA, DSP, DRAM/NAND Flash Memory, Power Management, Wireless RF, Image Sensor, LCD/LED/OLED driver, ADC/DAC, etc.
Circuit extraction: according to the chip image database, relying on the Cellix's EDA software platform, identify the analog devices, digital cells, the vias and interconnects , finally get the flat schematic. The flat circuit schematic is difficult to understood.
Circuit analysis: based on Hierux System and BoolSmart System, combined with datasheet and other data, analyzed and organized the flat schematic into the hierarchical circuit that is easy to understand and reflects the original design idea and design skills of the chip.
Data delivery formats: EDIF200, Verilog, SPICE, VHDL, Workview and other standard formats.